On February 15th, the “Guidelines for Applying for Integrated Circuit Chip Subsidies in Zhongguancun Science City” were officially released at the 2025 Haidian District Economic and Social High Quality Development Conference on February 14th. It is aimed at enterprises engaged in integrated circuit design business in Haidian District, and supports integrated circuit design enterprises to carry out multi project wafer (MPW) or engineering product first round chip (full mask), with a maximum subsidy of 15 million yuan for a single enterprise. In terms of supporting integrated circuit design enterprises to carry out the first round of wafer fabrication (full mask) of engineering products, domestic enterprises that carry out advanced process (14nm and below) engineering product first round wafer fabrication (full mask) will be rewarded with no more than 30% of the product wafer fabrication cost, with a maximum limit of 8 million yuan per enterprise; For enterprises that carry out the first round of film production (full mask) of mature process (above 14nm) engineering products within the country, a reward of no more than 20% of the product film production cost will be given, with a maximum limit of 5 million yuan per enterprise; For enterprises that carry out the first round of wafer fabrication (full mask) of advanced process (14nm and below) engineering products overseas, a reward of no more than 15% of the product wafer fabrication cost will be given, with a maximum limit of 5 million yuan per enterprise.
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