On March 15th, Pan Gongsheng, the Governor of the People’s Bank of China, recently stated that in order to further increase financial support for technological innovation, the People’s Bank of China will work with departments such as the China Securities Regulatory Commission and the Ministry of Science and Technology to innovate and launch a “technology board” in the bond market. Experts say that the establishment of the “technology board” in the bond market is not only an innovation in financing tools, but also a key breakthrough in the financial support system for technological innovation. By combining diversified bond products, policy incentives, and market-oriented mechanisms, it is expected to further alleviate the financing difficulties of technology enterprises, accelerate the transformation of scientific and technological achievements, and assist in the implementation of the national innovation driven development strategy. (China Securities Journal)
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