On March 17th, recently, the bond market’s “technology board” has become a widely discussed topic in the market. Industry insiders believe that the launch of the “Science and Technology Board” in the bond market will further facilitate the bond financing channels for technology companies, optimize the funding support mechanism, and promote the participation of multiple entities such as financial institutions, technology-based enterprises, and private equity institutions in the technology innovation bond market, providing more comprehensive full life cycle financial services for technology companies. Despite the continuous emergence of science and technology innovation bond varieties in recent years, there are currently problems such as concentrated issuers, financing bottlenecks, and lack of patient investors. Several experts have stated that in the future, it is necessary to cultivate a bond investment and financing ecosystem for science and technology innovation enterprises from multiple aspects, in order to achieve efficient matching between bond market funds and financing needs in the field of science and technology innovation. (Shanghai Stock News)
Scan code to share