On December 31st, it was reported that since the beginning of this year, the bond market has continued to play a role in achieving tangible results. Among them, the financing scale of the technology innovation company bond market is rapidly expanding, and the pace of serving the field of technology innovation is constantly accelerating. According to data statistics, as of December 30th this year, a total of 537 sci-tech innovation bonds have been issued, with a total issuance scale of 611.151 billion yuan. The number and scale of issuances have increased by 68.87% and 75.17% respectively compared to the same period last year. At the same time, from the perspective of issuance trends, the issuance of internal innovation bonds this year presents characteristics such as diversified issuance methods, high credit ratings of issuing entities, low coupon rates, large issuance scales, and flexible issuance terms. (Securities Daily)
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